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Jia De’s patented pre-cut lamination system only requires roll material. After die-cutting into irregular shapes, the line performs alignment, double-sided lamination, and AOI inspection.
A sheet-to-sheet process for film peeling, double-sided lamination, precision inspection, automatic compensation, and AOI. Supports FFU parameter monitoring, particle monitoring, ESD monitoring, and MES integration.
Integrated with a BOD production line, this system performs roll-to-sheet double-sided lamination, film cutting and segmentation, and then packaging via a robotic arm.
Wafers are loaded/unloaded via a wafer cassette, then processed through cutting, transfer lamination, alignment, film peeling, and film covering—transferring the product onto another adhesive tape.
EFEM handles wafer loading/unloading, then the material goes through backgrinding, plasma, dry spin, and wet spin to complete thinning and cleaning.
