Film Peeling Equipment

HomeApplications -Film Peeling Equipment

Jia De Precision Machinery offers a range of film peeling systems, supporting various sizes, form factors, and materials. Optional heating, plasma, and de-bonding modules are available, and both standalone machines and full-line solutions can meet diverse film peeling requirements.
加熱平台雙夾爪撕膜機

Size: 100–700 × 0.4–4 mm (custom sizes available)

Carrier Board Film Peeling Machine

Size: 100–700 × 0.4–4 mm (custom sizes available)

Heated Platform
Dual Peeling Arms
Compatible with Multiple Materials
Packaging Process
Wafer Automatic Film Peeling Machine

Size: 12 inch (custom sizes available)

Vision Alignment
Notch Peeling
Compatible with Multiple Materials
CoWoS Process
載板破口撕膜機

Size: 12 inch (custom sizes available)